IDT, Integrated Device Technology Inc ZSSC3018BA2C
- ZSSC3018BA2C
- IDT, Integrated Device Technology Inc
- DICE (WAFER SAWN) - FRAME
- Interface - Sensor and Detector Interfaces
- ZSSC3018BA2C Лист данных
- -
- Tray
- Lead free / RoHS Compliant
- 3235
- Запасы спот / разрешенные дилеры / излишки на заводе
- Гарантия качества на 1 год 》
- Нажмите, чтобы узнать цены
Part Number ZSSC3018BA2C |
Category Interface - Sensor and Detector Interfaces |
Manufacturer IDT, Integrated Device Technology Inc |
Description DICE (WAFER SAWN) - FRAME |
Package Tray |
Series - |
Type - |
Operating Temperature - |
Mounting Type - |
Package / Case - |
Supplier Device Package - |
Current - Supply - |
Output Type - |
Input Type - |
Package_case - |
ZSSC3018BA2C Гарантии
• Ответьте оперативно
• Гарантированное качество
• Глобальный доступ
• Конкурентоспособная рыночная цена
• Универсальные услуги цепочки поставок
Jinftry, это ваш самый надежный поставщик компонентов, добро пожаловать, чтобы отправить нам запрос, спасибо!
У вас есть вопросы о ZSSC3018BA2C ?
Не стесняйтесь связаться с нами:
+86-755-82518276
+8615019224070, annies65, +8615118125813
568248857, 827259012, 316249462
+8615019224070, +8615118118839, +8615118125813
( Электронная почта в первую очередь )
Комментарии
IDT, Integrated Device Technology Inc
ZSSC3026CC1C
DICE (WAFER SAWN) - FRAME
ZSSC3026CC6C
DICE (WAFER SAWN) - FRAME
ZSSC3026CI1C
DICE (WAFER SAWN) - FRAME
ZSSC3026CI1D ES
DICE (WAFER SAWN) - FRAME
ZSSC3026CI6C
DICE (WAFER SAWN) - FRAME
ZSSC3036CC1C
DICE (WAFER SAWN) - FRAME
ZSSC3036CI1D ES
DICE (WAFER SAWN) - FRAME
ZSSC3122AA1B
DICE (WAFER SAWN) - FRAME
A comprehensive overview of CMOS technology and its advantages
CMOS (Complementary Metal-Oxide Semiconductor) technology is a manufacturing process widely used in microprocessors and other integrated circuits. It is based on the complementary oxide semiconductor field effect transistor (MOSFET) structure, using N-type and P-type MOSFETs to form logic gates and other circuits. Due to its low power consumption and high integration, CMOS technology has become the mainstream chip manufacturing technology in today's electronic devices.
CMOS (Complementary Met
What is BGA
What is BGA? BGA encapsulation definition,What are the advantages of BGA?Classification of BGA packages,The full name of BGA is called "ball grid array", or "ball grid source array package". BGA can be an extreme product of LGA, PGA, or it can be arbitrarily replaced with different characteristics.
What does a power management IC do?
What Are Power Management ICs?
What does a power management IC do?
Classification of Power Management IC
Applications of Power Management IC
How to find a trust supplier of Power Management IC Supplier?
What are Data Acquisition ICs?
Why does the Data Acquisition IC Important to Electronic Devices?With the very quick development of the big data era, the electronics became more and more popular and neccessary to our daily life. And as an key part in the electronic device, Data Acquisition Integrated Circuits (ICs) are finding applications across a wide spectrum of industries and domains. Their ability to convert analog signals into digital data, along with various built-in functionalities, makes them indispensable for numerou