Renesas Electronics America Inc UPD70F3557AM1GMA1-GBK-AX
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- UPD70F3557AM1GMA1-GBK-AX
- Renesas Electronics America Inc
- IC MCU 32BIT 1.5MB FLSH 176HLQFP
- Embedded - Microcontrollers
- UPD70F3557AM1GMA1-GBK-AX Лист данных
- 176-LQFP Exposed Pad
- Tray
-
Lead free / RoHS Compliant - 8423
- Запасы спот / разрешенные дилеры / излишки на заводе
- Гарантия качества на 1 год 》
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| Part Number UPD70F3557AM1GMA1-GBK-AX |
| Category Embedded - Microcontrollers |
| Manufacturer Renesas Electronics America Inc |
| Description IC MCU 32BIT 1.5MB FLSH 176HLQFP |
| Package Tray |
| Series V850E2/Fx4 |
| Operating Temperature -40°C ~ 110°C (TA) |
| Mounting Type Surface Mount |
| Package / Case 176-LQFP Exposed Pad |
| Supplier Device Package 176-HLQFP (24x24) |
| Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V |
| Speed 80MHz |
| Number of I/O 136 |
| EEPROM Size 64K x 8 |
| Core Processor V850E2 |
| RAM Size 112K x 8 |
| Core Size 32-Bit |
| Connectivity CANbus, CSI, I²C, LINbus, UART/USART |
| Peripherals DMA, PWM, WDT |
| Program Memory Size 1.5MB (1.5M x 8) |
| Program Memory Type FLASH |
| Data Converters A/D 40x12b |
| Oscillator Type Internal |
| Package_case 176-LQFP Exposed Pad |
UPD70F3557AM1GMA1-GBK-AX Гарантии
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