NE5532AD8G

ON Semiconductor NE5532AD8G

Изображение только для справки, пожалуйста, обратитесь к спецификации продукта

  • NE5532AD8G
  • ON Semiconductor
  • IC OPAMP GP 2 CIRCUIT 8SOIC
  • Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
  • NE5532AD8G Лист данных
  • 8-SOIC (0.154\", 3.90mm Width)
  • Tube
  • Lead free / RoHS Compliant,https://www.jinftry.ru/product_detail/NE5532AD8GLead free / RoHS Compliant
  • 18494
  • Запасы спот / разрешенные дилеры / излишки на заводе
  • Гарантия качества на 1 год 》
  • Нажмите, чтобы узнать цены
Part Number
NE5532AD8G
Category
Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
Manufacturer
ON Semiconductor
Description
IC OPAMP GP 2 CIRCUIT 8SOIC
Package
Tube
Series
-
Operating Temperature
0°C ~ 70°C (TA)
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154\", 3.90mm Width)
Supplier Device Package
8-SOIC
Current - Supply
8mA
Output Type
-
Number of Circuits
2
Voltage - Supply, Single/Dual (±)
6V ~ 40V, ±3V ~ 20V
Current - Output / Channel
38 mA
-3db Bandwidth
-
Amplifier Type
General Purpose
Current - Input Bias
300 nA
Voltage - Input Offset
500 µV
Slew Rate
9V/µs
Gain Bandwidth Product
10 MHz
Package_case
8-SOIC (0.154\", 3.90mm Width)

NE5532AD8G Гарантии

jinfftry-guarantee1,https://www.jinftry.ru/product_detail/NE5532AD8G

jinfftry-guarantee2,https://www.jinftry.ru/product_detail/NE5532AD8G

jinfftry-guarantee3,https://www.jinftry.ru/product_detail/NE5532AD8G

• Ответьте оперативно

• Гарантированное качество

• Глобальный доступ

• Конкурентоспособная рыночная цена

• Универсальные услуги цепочки поставок

Jinftry, это ваш самый надежный поставщик компонентов, добро пожаловать, чтобы отправить нам запрос, спасибо!

У вас есть вопросы о NE5532AD8G ?
Не стесняйтесь связаться с нами:

+86-755-82518276
+8615019224070, annies65, +8615118125813
568248857, 827259012, 316249462
+8615019224070, +8615118118839, +8615118125813
( Электронная почта в первую очередь )

Комментарии

Оставьте свой комментарий

ON Semiconductor
ON Semiconductor,https://www.jinftry.ru/product_detail/NE5532AD8G
MC33174DG,https://www.jinftry.ru/product_detail/NE5532AD8G
MC33174DG

IC OPAMP GP 4 CIRCUIT 14SOIC

MC34072VDG,https://www.jinftry.ru/product_detail/NE5532AD8G
MC34072VDG

IC OPAMP GP 4 CIRCUIT 14SOIC

MC33074DTBG,https://www.jinftry.ru/product_detail/NE5532AD8G
MC33074DTBG

IC OPAMP GP 4 CIRCUIT 14SOIC

MC34074VPG,https://www.jinftry.ru/product_detail/NE5532AD8G
MC34074VPG

IC OPAMP GP 4 CIRCUIT 14SOIC

NE5517DG,https://www.jinftry.ru/product_detail/NE5532AD8G
NE5517DG

IC OPAMP GP 4 CIRCUIT 14SOIC

MC33201DG,https://www.jinftry.ru/product_detail/NE5532AD8G
MC33201DG

IC OPAMP GP 4 CIRCUIT 14SOIC

MC33171DG,https://www.jinftry.ru/product_detail/NE5532AD8G
MC33171DG

IC OPAMP GP 4 CIRCUIT 14SOIC

MC34071ADG,https://www.jinftry.ru/product_detail/NE5532AD8G
MC34071ADG

IC OPAMP GP 4 CIRCUIT 14SOIC

What is BGA

What is BGA? BGA encapsulation definition,What are the advantages of BGA?Classification of BGA packages,The full name of BGA is called "ball grid array", or "ball grid source array package". BGA can be an extreme product of LGA, PGA, or it can be arbitrarily replaced with different characteristics.

What is the structure and function of PCB?

PCB (Printed Circuit Board) is one of the basic components in modern electronic equipment. It provides a platform to support and connect electronic components. The internal structure of PCB is composed of multi-layer circuit board, conductive layer, insulating layer, pad, circuit layer, circuit spacing, circuit spacing, via holes, silk screen layer and solder mask layer. These components cooperate with each other to form a complete circuit board, providing reliable electrical connection and pro

What are the commonly used data acquisition chips

What are the commonly used data acquisition chips.Working principle of data acquisition hardware Temperature sensor is a kind of equipment to measure temperature, which can be widely used in industry, automobile and other fields. At present, the commonly used temperature sensor chips are DS18B20, MAX31855, LM35 and so on.

Broadcom launches new Wi-Fi 7 chip ic for routers and mobile phones, technical comparison of Wi-Fi 6 VS Wi-Fi 7

BCM4366  - 4x4 802.11ac Wave 2 Wi-Fi chip with MU-MIMO support. BCM2837  - 64-bit ARM Cortex-A53 chip for Raspberry Pi 3. BCM43438  - Wi-Fi + Bluetooth chip for Raspberry Pi 3. BCM57810  - 10Gb Ethernet controller for server and storage applications. BCM56960  - 25/100Gb Ethernet switch chip for data center switches. BCM43455   - Single chip 5G Wi-Fi (802.11ac) solution. BCM53125  - Gigabit Ethernet switch for home and small office networks. BCM20702  - Bluetooth 4.0 single
Индекс продукции
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
W
X
Y
Z
0
1
2
3
4
5
6
7
8
9
Shopping Cart Tel: +86-755-82518276 Email: sales@jinftry.com Skype: +8615019224070, annies65, +8615118125813 QQ: 568248857, 827259012, 316249462 Mobile: +8615019224070, +8615118118839, +8615118125813 WeChat: Send Message
TOP