3M (TC) 3M AB5010 1" X 2"-100
Изображение только для справки, пожалуйста, обратитесь к спецификации продукта
- 3M AB5010 1" X 2"-100
- 3M (TC)
- SHEET PLYMR 25.4X50.8MM 100/PK
- RFI and EMI - Shielding and Absorbing Materials
- 3M AB5010 1" X 2"-100 Лист данных
- -
- -
-
Lead free / RoHS Compliant - 12340
- Запасы спот / разрешенные дилеры / излишки на заводе
- Гарантия качества на 1 год 》
- Нажмите, чтобы узнать цены
Службы доставки:
Способы оплаты:
| Part Number 3M AB5010 1" X 2"-100 |
| Category RFI and EMI - Shielding and Absorbing Materials |
| Manufacturer 3M (TC) |
| Description SHEET PLYMR 25.4X50.8MM 100/PK |
| Package - |
| Series AB5000S |
| Type Absorbing Sheet |
| Operating Temperature -25°C ~ 85°C |
| Shape Rectangular |
| Length 2.000" (50.80mm) |
| Width 1.000" (25.40mm) |
| Thickness - Overall 0.005" (0.13mm) |
| Adhesive Non-Conductive, Single Sided |
| Material Polymer Resin, Metal Flakes |
| Package_case - |
3M AB5010 1" X 2"-100 Гарантии
• Ответьте оперативно
• Гарантированное качество
• Глобальный доступ
• Конкурентоспособная рыночная цена
• Универсальные услуги цепочки поставок
Jinftry, это ваш самый надежный поставщик компонентов, добро пожаловать, чтобы отправить нам запрос, спасибо!
У вас есть вопросы о 3M AB5010 1" X 2"-100 ?
Не стесняйтесь связаться с нами:
+86-755-82518276
+8615019224070, annies65, +8615118125813
568248857, 827259012, 316249462
+8615019224070, +8615118118839, +8615118125813
( Электронная почта в первую очередь )
3M AB5010 1" X 2"-100 сопутствующие товары
Комментарии
3M (TC)
5-AB5010-1-4R
SHEET PLYMR 25.4X101.6MM 5/PK
5-AB5010-3/4-3R
SHEET PLYMR 25.4X101.6MM 5/PK
5-AB5010-1/2-3R
SHEET PLYMR 25.4X101.6MM 5/PK
5-AB5010-3/4-2R
SHEET PLYMR 25.4X101.6MM 5/PK
5-AB5010-1/2-2R
SHEET PLYMR 25.4X101.6MM 5/PK
3M AB5010 2"SQ-100
SHEET PLYMR 25.4X101.6MM 5/PK
3M AB5010 1.5"SQ-100
SHEET PLYMR 25.4X101.6MM 5/PK
5-AB5030-1.5
SHEET PLYMR 25.4X101.6MM 5/PK
What is BGA
What is BGA？ BGA encapsulation definition，What are the advantages of BGA？Classification of BGA packages，The full name of BGA is called "ball grid array", or "ball grid source array package". BGA can be an extreme product of LGA, PGA, or it can be arbitrarily replaced with different characteristics.
Three-Phase SiC Gate Driver Silicon Carbide Applications
Three-Phase SiC Gate Driver Silicon Carbide Applications
The design of the CXT-PLA3SA12450AA three-phase gate driver is derived from the fully tested and verified CMT-TIT8243 [1, 2] and CMT-TIT0697 [3] single-phase gate driver boards, respectively designed for 62mm 1200V/300A and Fast switching XM3 1200V/450A SiC MOSFET power module (see Figure 4). The three-phase gate driver is optimized to be mounted directly on top of the CXTPLA3SA12450 power module, thanks to a more compact transformer de
FT234XD-R USB datasheet PDF, pin assignments, application areas
FT234XD-R USB datasheet PDF, pin assignments, application areas
FT234XD-R Introduction:
The FT234XD-R provides a bridge from USB to basic UART. This device is ideal for many applications, especially those that do not require complex input/output or a large number of pins, but do require USB functionality. It provides simplified functionality while maintaining the high quality and performance of FTDI's USB 2.0 devices.
Power Integrity (PI) Design and Test Methodology
Power Integrity (PI) Design and Test Methodology
Power integrity (Power Integrity, referred to as PI) is a very important part of electronic system design, especially high-speed digital systems.
PI is generally concerned with ensuring that the various components in the system receive clear, clean, and constant power.
To this end, a suitable power distribution network (Power Distribution Network, PDN) needs to be designed and tested to ensure that its performance is up to standard.
