Adafruit Industries LLC 381
- 381
- Adafruit Industries LLC
- WATERPROOF DS18B20 DIGITAL TEMPE
- Temperature Sensors - Thermocouple, Temperature Probes
- 381 Лист данных
- -
- -
- Lead free / RoHS Compliant
- 1319
- Запасы спот / разрешенные дилеры / излишки на заводе
- Гарантия качества на 1 год 》
- Нажмите, чтобы узнать цены
Part Number 381 |
Category Temperature Sensors - Thermocouple, Temperature Probes |
Manufacturer Adafruit Industries LLC |
Description WATERPROOF DS18B20 DIGITAL TEMPE |
Package - |
Series - |
Package_case - |
381 Гарантии
• Ответьте оперативно
• Гарантированное качество
• Глобальный доступ
• Конкурентоспособная рыночная цена
• Универсальные услуги цепочки поставок
Jinftry, это ваш самый надежный поставщик компонентов, добро пожаловать, чтобы отправить нам запрос, спасибо!
У вас есть вопросы о 381 ?
Не стесняйтесь связаться с нами:
+86-755-82518276
+8615019224070, annies65, +8615118125813
568248857, 827259012, 316249462
+8615019224070, +8615118118839, +8615118125813
( Электронная почта в первую очередь )
Комментарии
Adafruit Industries LLC
642
HIGH TEMP WATERPROOF DS18B20 DIG
3245
HIGH TEMP WATERPROOF DS18B20 DIG
1137
HIGH TEMP WATERPROOF DS18B20 DIG
1343
HIGH TEMP WATERPROOF DS18B20 DIG
983
HIGH TEMP WATERPROOF DS18B20 DIG
985
HIGH TEMP WATERPROOF DS18B20 DIG
984
HIGH TEMP WATERPROOF DS18B20 DIG
979
HIGH TEMP WATERPROOF DS18B20 DIG
Key electronic technologies and IC (integrated circuit) applications for self-driving cars
Key electronic technologies and IC (integrated circuit) applications for self-driving cars
A self-driving car, also known as a self-driving vehicle or driverless car, is a car that can perform driving tasks automatically without human intervention.
It is a complex technology involving artificial intelligence, sensor technology, computer vision, machine learning and advanced control systems.
Analog Devices-Dual and single µModule regulators provide high peak and thermal performance
ADI's Power by Linear LTM4662 is a dual 15A and single 30A step-down µModule regulator, using BGA packaging technology, with exposed stacked inductors to improve thermal performance. The remaining components, DC-DC controller, MOSFET and supporting components are all compressed. The entire device is packaged in 11.25mm x 15mm x 5.74mm BGA. In the case of restricted airflow, the device is easy to cool because the inductor quickly transfers heat from the power stage to the surrounding environme